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Product Name: |
Dicing Blades Without Hub
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Supply Ability: |
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Related proudcts |
wafer saw blade, |
Specifications |
Dicing Blades Without Hub |
Price Term: |
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Port of loading: |
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Minimum Order |
1 |
Unit Price: |
USD10-USD2,000/pc |
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The wafer dicing blade without hub is a kind of ultra-thin and precision diamond dicing blades with excellent cutting ability, good rigidity, and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ceramics, etc. |
Company: |
Henan E-Grind Abrasives Co., Ltd.
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Contact: |
Mr. egrind wheel |
Address: |
Room 1841, Tower A, Wanda Plaza, 171#, Zhongyuan Road, Zhengzhou City, Henan Province, China |
Postcode: |
450000 |
Tel: |
0371-68616868 |
Fax: |
0371-68616868 |
E-mail: |
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